Chem. Commun., 2019, Accepted Manuscript
DOI: 10.1039/C8CC08219G, Communication
DOI: 10.1039/C8CC08219G, Communication
Binbin Wei, Hanfeng Liang, Zhengbing Qi, Dongfang Zhang, Hao Shen, Wenshen Hu, Zhoucheng Wang
We report the preparation of 3D binder-free Si@Ti@TiN thin film array electrodes for supercapacitors using deep silicon etching and magnetron sputtering for the first time. This work not only offers...
The content of this RSS Feed (c) The Royal Society of Chemistry
We report the preparation of 3D binder-free Si@Ti@TiN thin film array electrodes for supercapacitors using deep silicon etching and magnetron sputtering for the first time. This work not only offers...
The content of this RSS Feed (c) The Royal Society of Chemistry
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